Welcome!
The ReCAST activities are mainly related to:
- thin film Physical Vapor Deposition (dc, rf, pulsed bipolar magnetron sputtering, cathodic vacuum arc, thermal evaporation) with associated physical characterization methods;
- plasma surface treatments;
- ultrahigh vacuum (UHV) technologies, including leak detection by mass spectrometry;
- ion sources for ion assisted surface processing.
Thin film deposition research activities were developed in the last four years especially due to potential applications in material coatings and surface engineering. Ion assisted magnetron sputtering and cathodic vacuum arc were applied and developed preferentially. The Mass spectrometry helium leak detection, vacuum brazing and UHV physics and related technology are also landmarks of ReCAST at national level.
The development of the laboratory infrastructure was mainly focused on enhancing the existing thin film deposition and surface processing capabilities, resulting a complex, versatile, yet complementary laboratory infrastructure. Also, dedicated thin film characterization systems were purchased and installed to complete the infrastructure and make possible a quick and high quality evaluation of the processed samples.
The research Centre for Advanced Surface Processing and Analysis by Vacuum Technologies became Excellence Research Center, after a four years competitive process supervised by RELANSIN – a Romanian Research and Innovation Program aiming for national economic RE-LAunching.
Project Title: Transfer and implementation of Thermionic Vacuum Arc (TVA) coating technology for high hardness, low coefficient of friction and anti-corrosion
Contract no.: 13PTE ⁄ 2025
Acronim: TITVA
The main purpose of the project is the transfer and implementation of the coating technology developed by INFLPR (Thermionic Arc in Vacuum - TVA) to obtain films with high hardness, low friction coefficient and anti-corrosive films. The stages that will be completed for the purpose are: the concept, the design, the realization of the original layers deposition device, the preparation of the thin films with high hardness, low friction coefficient, or anticorrosive, the mechanical characteristics study of the deposited layers and the optimization of the deposition parameters depending on their application. Consequently, the main objective of this project proposal is the technological transfer and implementation of the TVA method, which is currently validated TRL 4, from INFLPR (P1) to the private company MGM Star S.R.L (CO) with the support of INOE 2000 (P2). Within this project, the coordinator will take the thermionic vacuum arc method from the stage of technology validated in laboratory conditions and together with the competencies of the two partners in the consortium will have at the end a demonstrated technology from the point of view of functionality in the industrial environment - TLR6. This technology will later be used by the project coordinator to deliver coating services to the industry to improve the used materials in terms of hardness, friction coefficient and corrosion resistance.
In particular, the topics of interest include, but are not limited to: surface science of bioactive coatings,deposition and growth of biocompatible coatings, coatings-based polymers, surface modification by directed energy deposition (lasers, ion, or electron beams) or other techniques such as plasmas, friction performance, corrosion, and wear resistance of coated load-bearing implants and/or dental implants.
Deadline for manuscript submissions: 30 April 2021.
Note: All submissions from INOE2000 will receive a 20% discount on Article Processing Charge (APC).
Dr. Alina Vladescu
Guest Editor
FREE TRIAL OXFORD JOURNALS Oxford University Press, prin partenerul său în România – ROMDIDAC - și Asociația Anelis Plus oferă, în perioada 1.10.2021-31.12.2021, instituțiilor membre în Asociație, acces gratuit la revistele electronice incluse în Full Journals Collection, disponibilă pe platforma Oxford Academic - https://academic.oup.com/journals. Accesul se va face pe baza IP-urilor instituționale.